Core Features
- Static Dissipative Properties: Specifically formulated with carbon-filled additives to provide essential Electrostatic Discharge (ESD) protection, preventing static buildup that could damage sensitive semiconductor wafers or electronic components.
- Precision Machined Slot Geometry: Engineered via high-precision CNC machining to create exact slot widths and depths, ensuring uniform spacing and secure retention for substrates.
- Extreme Thermal Endurance: Maintains absolute dimensional stability and structural rigidity in continuous operating environments up to 250°C (482°F).
- High-Purity & Low Outgassing: Manufactured to ensure a metallic-ion-free environment with minimal outgassing, satisfying the strict requirements for ultra-high vacuum (UHV) and clean-room applications.
- Superior Chemical Immunity: Completely resistant to aggressive industrial solvents, etching acids, and organic bases, ensuring the panel does not warp or degrade during wet-processing cycles.




